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Solution center
Electronics industry are becoming more customers oriented. The consumers are fickle in affection and very sensitive to the price. In response to more harsh environment, both OEM and device suppliers need products more modular.
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Louci have experts in electronics industry with long term experience on electronic packaging and assembly. So we can present you the multiple solutions. |
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Lead free
Lead free is one major topic in SMT, packaging and manufacture. Reflow temperature is raised between 245℃ to 260℃, which gave requirement to device, PCB and related process.
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Flip chip
Flip chip technology get more and more application. At the same time, it create new challenges for designing, production and testing. |
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DPA
Destructive Physical Analysis (DPA) is used to ensure high reliability components or devices are fabricated to the required standards.
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Moisture Sensitivity Levels
Moisture absorption is a major problem causing damage or delamination of the package, especially for thinner and smaller packaging device.
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ESD/EOS analysis
Electrical Over-stress (EOS) and Electrical Static Discharge (ESD is a mojor reason for failure. More challenges come from with new technology and material introduction. High density PCB with low voltage chips have more risk of ESD/EOS failure. |
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Failure analysis
Since its birth, electronics industry is always fighting against different kinds of failure. |
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